Die Attach. Die Bond. Die Mount. All of these words are synonymous with a key step in the process of semiconductor packaging. This microscopic world creates the heartbeat of many important electronic assemblies that the modern world takes for granted: cell phones, pacemakers, stereo systems, and more.

With the ever-shrinking packaging of today's electronic components, the manufacturing world is in a never-ending battle to meet the lightspeed needs of the electronics industry with the smallest possible footprint.

As these needs become more intricate, the die attach specialist, who possesses the knowledge that can smooth the development and production path of the semiconductor manufacturer, is becoming a rare commodity. The die attach specialist must provide the capability of honing the mechanical functions of the die bonder, as well as the knowledge to develop the application that will create the semiconductor package. It is impossible to create the optimal packaging without hardware and application knowledge.

J Brajkovich Die Attach Specialties wants to help the semiconductor manufacturer enhance their production capabilities through a customized die attach program that is designed to meet their key needs without interfering with their schedule.